Taw qhia
Thaum lub sijhawm ua haujlwm, lub hauv paus tswj hwm lub hauv paus ntawm cov tsheb ciav hlau thauj mus los tau ua rau qis qis tsis tu ncua - zaus vibrations thiab sai sai siab - acceleration shocks. Nyob rau hauv cov kev mob siab no - kev co, qhov tseem ceeb tshaj plaws kev hem thawj rau PCBA manufacturing yog brittle puas ntawm cov pob qij txha. Hom kev puas tsuaj no feem ntau tshwm sim ntawm qhov sib txuas ntawm intermetallic (IMC) ntawm cov hlau lead- cov pob qij txha pub dawb thiab PCB pads. Nws yog tus cwj pwm los ntawm qhov pib tshwm sim tam sim ntawd yam tsis muaj kev ceeb toom thiab tuaj yeem yooj yim ua rau muaj teeb meem cuam tshuam lossis tswj kev ua tsis tiav ntawm cov tsheb ciav hlau. Txhawm rau txhim kho kev co qaug zog lub neej ntawm kev tsheb nqaj hlau thauj mus los mainboards, cov kev daws teeb meem tseem ceeb nyob hauv kev ua kom zoo ntawm cov khoom siv hlau los ntawm micro- metallurgical foundations.
Mechanism of Brittle Fracture Nyob rau hauv Vibration Stress: Stress Concentration hauv IMC Txheej
Thaum lub sij hawmreflow solderingtheem ntawm PCBA manufacturing, lub tin nyob rau hauv cov pa hlau lead- dawb solder reacts nrog tooj liab nyob rau hauv PCB nto, inevitably tsim ib txheej ntawm intermetallic compounds (IMC). Txawm hais tias cov qauv eutectic no ua haujlwm raws li daim ntawv cog lus rau kev sib txuas ntawm cov neeg kho tshuab muaj zog, nws yog ib qho khoom siv nkig. Thaum lub sij hawm kev pab cuam lub neej ntawm rail transit khoom, complex alternating mechanical stresses tsis tu ncua ua nyob rau hauv lub Cheebtsam thiab substrate. Vim qhov sib txawv tseem ceeb hauv coefficients ntawm thermal expansion (CTE) thiab elastic moduli ntawm PCB substrate (FR-4) thiab ceramic Cheebtsam los yog silicon chips, mechanical deformation stresses generated los ntawm kev co ua heev concentrated ntawm IMC interface, uas tsuas yog ob peb micrometers tuab. Thaum cov kev nyuaj siab shear ntau tshaj lub zog ntawm daim ntawv cog lus ntawm cov ciam teb, cov kab nrib pleb sai sai pib thiab nthuav tawm tom qab hauv IMC lossis ntawm nws qhov cuam tshuam nrog cov tooj liab ncoo, ua rau tam sim ntawd nkig delamination ntawm solder sib koom.
Ntxiv Cov Kab Ntau Lawm ntawm Bismuth thiab Antimony: Txhim kho cov Tin Matrix thiab Refining Cov Qauv Grain
Txhawm rau tiv thaiv siab - siv tshuab kev vibrations, kev txhim kho microstructure ntawm solder alloy thiab qeeb tus nqi ntawm tawg propagation yog lub hom phiaj tseem ceeb hauv optimizing cov alloy muaj pes tsawg leeg. Nyob rau hauv qhov chaw -mount manufacturing ntawm siab- fais fab mainboards rau kev tsheb ciav hlau, tshiab siab -kev ntseeg siab alloys-raws li tsoos tin-silver-tooj liab (SAC) tab sis doped nrog ib tug npaum li cas ntawm bismuth (Bi) thiab Stibium (Sb) dav siv tam sim no {{8} Kev koom ua ke ntawm bismuth ua rau muaj kev sib zog ua kom muaj zog, ua kom cov txiaj ntsig zoo ntawm cov hlau matrix nws tus kheej. Lub caij no, qhov sib ntxiv ntawm antimony slows tus nqi ntawm grain coarsening nyob rau hauv siab -kub thiab kev nyuaj siab tej yam kev mob, tuav ib tug nplua -grained microstructure. Cov nplej nplua nuj ua rau muaj qhov nce ntau ntawm cov qoob loo ciam teb. Thaum vibration shock nthwv dej propagate mus rau hauv lub solder sib koom tes, cov qoob loo ntau ciam teb zoo disperse thiab nqus lub zog, yuam microcracks tsis tu ncua hloov lawv cov kev taw qhia ntawm propagation thiab lengthening lawv txoj kev mus rau nkag mus rau hauv, yog li ncua lub dynamic qaug zog lub neej ntawm lub solder sib koom los ntawm ntau tshaj 1.5 zaug.
Synergistic Effects of Trace Numbers of Nickel thiab Cobalt: Hloov Kho IMC Morphology thiab Thickness
Thaum tswj lub zog ntawm crystalline matrix, nws yog ib qho tseem ceeb kom ncaj qha "nyias" thiab hloov cov microstructure ntawm IMC txheej - qhov chaw uas brittle fracture tshwm sim. Los ntawm kev qhia cov lej ntawm npib tsib xee (Ni) thiab cobalt (Co)-kwv yees li 0.05%- rau hauv cov hlau nplaum nplaum, qhov kev loj hlob kinetics ntawm interfacial intermetallic compounds thaum lub sij hawm reflow txheej txheem tuaj yeem hloov pauv loj heev. Nickel tuaj yeem hloov pauv ib feem ntawm cov tooj liab, hloov pauv qhov qub ntxhib, kiv cua- zoo li tus, thiab tsis sib npaug tuab eutectic txheej rau hauv ib qho smoother, denser, thiab uniformly tuab composite siv lead ua qauv. Cobalt, ntawm qhov tod tes, muaj txiaj ntsig zoo txwv tsis pub muaj kev loj hlob tsis zoo ntawm cov neeg pluag- txheej nkig zoo tshwm sim los ntawm kev sib kis thib ob uas tshwm sim los ntawm qhov kub thiab txias thaum lub sij hawm PCBA cov kev pab cuam tom qab ntev -. Kev tswj nruj nruj ntawm tag nrho cov tuab ntawm IMC txheej nyob rau hauv qhov kev pom zoo tuaj yeem txo qhov kev ntxhov siab ntawm qhov sib cuam tshuam thiab tshem tawm cov xwm txheej uas tsim nyog rau kev tawg tawg.
Ua ke nrog Kev Kho Nto Kho Tshuab: Tsim Metallurgical Interface Uas Ntsuas Rigidity thiab Flexibility
Qhov zoo ntawm cov khoom siv solder yuav tsum ua kom zoo sib xws, ob qho tib si lub cev thiab tshuaj lom neeg, nrog rau qhov ua tiav ntawm PCB pads kom ua tiav qhov kev vibration zoo. Rau siab -vibration rail transit motherboards, electroplated npib tsib xee-kub (ENIG) nto tiav- uas tuaj yeem ua rau cov pad dub tshwm sim thiab nkig tawg ntawm phosphorus- nplua nuj txheej- feem ntau tsis pom zoo. Hloov chaw, organic solder preservative (OSP) lossis hluav taws xob- qib immersion silver (Im-Ag) yog qhov zoo dua. OSP nto kho mob tso cai rau cov formulation siab -kev ua tau zoo solder tuaj rau hauv kev sib cuag ncaj qha nrog liab qab tooj liab, tsim ib tug ntshiab tooj liab{11}} tin eutectic txheej thaum lub sij hawmreflow solderingthiab tiv thaiv lattice distortion ntawm lub interface tshwm sim los ntawm kev qhia ntawm thib peb - tog impurity hlau atoms. Nyob rau hauv no metallurgical interface, ua ke nrog ib tug tsim nyog thickness ntawm conformal txheej los yog hauv zos underfill, ib tug tiv thaiv mechanism uas sib npaug rigidity thiab saj zawg zog yog tsim - qhov twg cov txheej txheem sab nraud relieves kev nyuaj siab thiab lub sab hauv microstructure absorbs zog - yog li tshem tawm tag nrho cov muaj peev xwm ntawm brittle puas.
Kev kov yeej qhov teeb meem ntawm kev sib koom ua ke brittle fracture nyob rau hauv siab - vibration tej yam kev mob yuav tsum tau ib tug kev qhia txog kev mus kom ze, xws li kev nplua -tuning ntawm microstructural metallurgical muaj pes tsawg leeg mus rau optimization ntawm macroscopic txheej txheem tsis.
Cov lus qhia ceev ceev txog NeoDen
- Tsim los ntawm 2010 nrog 200+ cov neeg ua haujlwm & 27, 000+ Sq.m. Hoobkas ntawm cov cuab yeej ywj pheej, kom ntseeg tau tus qauv kev tswj hwm thiab ua tiav cov txiaj ntsig kev lag luam zoo tshaj plaws thiab txuag tus nqi.
- Muaj tus kheej lub chaw machining, txawj sib dhos, tester thiab QC engineers, los xyuas kom meej lub peev xwm muaj zog rau NeoDen tshuab tsim, zoo thiab xa.
- 40+ cov neeg koom tes thoob ntiaj teb suav nrog hauv Asia, Europe, Amelikas, Oceania thiab Africa, kom ua tiav kev pabcuam 10000+ cov neeg siv thoob plaws ntiaj teb, kom ntseeg tau tias cov kev pabcuam hauv zos zoo dua thiab nrawm dua thiab teb sai.
- 3 pawg R&D sib txawv nrog rau tag nrho 25+ cov kws tshaj lij R&D engineers, kom ntseeg tau tias qhov kev txhim kho zoo dua thiab siab dua thiab kev tsim kho tshiab.
- Cov kws tshaj lij thiab cov kws tshaj lij Askiv txhawb nqa & kev pabcuam engineers, kom paub meej cov lus teb tam sim hauv 8 teev, kev daws teeb meem muab hauv 24 teev.
- Ib qho tshwj xeeb ntawm tag nrho cov tuam txhab hauv Suav teb uas tau tso npe thiab pom zoo CE los ntawm TUV NORD.
- NeoDen muab lub neej-ntev kev txhawb nqa thiab kev pabcuam rau txhua lub tshuab NeoDen, ntxiv rau, kev hloov kho software tsis tu ncua raws li kev siv cov kev paub dhau los thiab kev thov niaj hnub los ntawm cov neeg siv khoom.